2027校招-数字硬件工程师-北京当面告知

爱立信(中国)有限公司
2026-12-08 11:33:18
校招27届硕士

岗位详情

地区:

北京

专业要求:

电气工程及其自动化通信工程微电子科学与工程

岗位职责:

About this opportunity: Join our R&D team at the forefront of next-generation radio technology development. You will be part of the Hardware Engineering organization responsible for the design and realization of high-performance radio products deployed worldwide. The team develops advanced digital hardware platforms built on memory technologies, high-speed interfaces, and ASIC-based solutions. What you will do: Digital hardware design, verification, and integration for radio products. Memory subsystem design validation and qualification, including DDR4, DDR5, eMMC, and emerging memory technologies. Contribute to technology scouting, evaluation, and introduction of new memory solutions for future products. Assist in board-level architecture, schematic design, bring-up, and verification for ASIC-based hardware platforms. Support board-level design and validation of high-speed links, such as SerDes, JESD, PCIe, and Ethernet interfaces. Perform laboratory testing, measurements, debugging, and root-cause analysis during board verification and system integration. Collaborate closely with ASIC, software, FPGA, signal integrity, PCB, mechanical, manufacturing, and verification teams to drive product success. Create and maintain design specifications, verification plans, test reports, and other product documentation. Engage with external chipset and component suppliers to support technical evaluation, issue resolution, and technology alignment. Drive continuous improvement in design methods, verification efficiency, processes, and product quality. 任职条件: The skills you bring: Master's degree in Electrical Engineering, Telecommunication Engineering, Microelectronics or related discipline. Solid foundation in digital circuits, electronic systems, computer architecture, and basic analog circuit principles. Basic understanding of memory technologies, such as DDR, LPDDR, Flash, or embedded storage, is preferred. Basic knowledge of high-speed digital interfaces, transmission lines, signal integrity, or PCB design fundamentals is preferred. Familiarity with FPGA, ASIC, SoC, or embedded system architecture through coursework, research, or projects is an advantage. Hands-on experience from internships, university laboratories, capstone projects, technical competitions, or personal engineering projects is highly valued. Basic experience with laboratory equipment, such as oscilloscopes, logic analyzers, spectrum analyzers, or protocol analyzers, is a plus. Strong learning agility, technical curiosity, and willingness to explore unfamiliar technologies and solve complex engineering problems. Analytical and structured problem-solving skills, with attention to quality, details, and engineering traceability. Proactive, collaborative, and able to take ownership while working effectively with international and cross-functional teams. Good written and spoken English for technical communication and collaboration.

招聘要求:

职位描述: About this opportunity: Join our R&D team at the forefront of next-generation radio technology development. You will be part of the Hardware Engineering organization responsible for the design and realization of high-performance radio products deployed worldwide. The team develops advanced digital hardware platforms built on memory technologies, high-speed interfaces, and ASIC-based solutions. What you will do: Digital hardware design, verification, and integration for radio products. Memory subsystem design validation and qualification, including DDR4, DDR5, eMMC, and emerging memory technologies. Contribute to technology scouting, evaluation, and introduction of new memory solutions for future products. Assist in board-level architecture, schematic design, bring-up, and verification for ASIC-based hardware platforms. Support board-level design and validation of high-speed links, such as SerDes, JESD, PCIe, and Ethernet interfaces. Perform laboratory testing, measurements, debugging, and root-cause analysis during board verification and system integration. Collaborate closely with ASIC, software, FPGA, signal integrity, PCB, mechanical, manufacturing, and verification teams to drive product success. Create and maintain design specifications, verification plans, test reports, and other product documentation. Engage with external chipset and component suppliers to support technical evaluation, issue resolution, and technology alignment. Drive continuous improvement in design methods, verification efficiency, processes, and product quality. 任职条件: The skills you bring: Master's degree in Electrical Engineering, Telecommunication Engineering, Microelectronics or related discipline. Solid foundation in digital circuits, electronic systems, computer architecture, and basic analog circuit principles. Basic understanding of memory technologies, such as DDR, LPDDR, Flash, or embedded storage, is preferred. Basic knowledge of high-speed digital interfaces, transmission lines, signal integrity, or PCB design fundamentals is preferred. Familiarity with FPGA, ASIC, SoC, or embedded system architecture through coursework, research, or projects is an advantage. Hands-on experience from internships, university laboratories, capstone projects, technical competitions, or personal engineering projects is highly valued. Basic experience with laboratory equipment, such as oscilloscopes, logic analyzers, spectrum analyzers, or protocol analyzers, is a plus. Strong learning agility, technical curiosity, and willingness to explore unfamiliar technologies and solve complex engineering problems. Analytical and structured problem-solving skills, with attention to quality, details, and engineering traceability. Proactive, collaborative, and able to take ownership while working effectively with international and cross-functional teams. Good written and spoken English for technical communication and collaboration.

公司介绍

爱

爱立信(中国)有限公司

爱立信(中国)有限公司,成立于1994-04-23,位于北京,法定代表人:方迎,登记状态:存续,注册资本6479.1万美元,公司类型:其他