2027届-技术工程师-NBG刻蚀 Technology Engineer-NBG当面告知
中微半导体设备(上海)股份有限公司
2026-11-21 14:45:42
校招博士27届硕士
岗位详情
地区:
上海市
专业要求:
工学
岗位职责:
Job Responsibilities
1. C&F test for new product development, including hardware and process test
2. Co-work with function team to define Hardware/Software spec, coordinate all the resource to complete function test on tool, publish related documents to release function
3. Lab tool management, tracking hardware feature evolution and performance
4. Conduct the functionality test/failure analysis/deliver reports on new products
5. Process development
Job Requirements
1. Master or PH.D, majored in science or engineering
2. Strong hands on skills is a MUST
3. Strong innovative and logical thinking, problem solving skills
4. Self-motivated with sense of accountability
6. Good communication skills, written and verbal, in both Chinese and English
招聘要求:
Job Responsibilities
1. C&F test for new product development, including hardware and process test
2. Co-work with function team to define Hardware/Software spec, coordinate all the resource to complete function test on tool, publish related documents to release function
3. Lab tool management, tracking hardware feature evolution and performance
4. Conduct the functionality test/failure analysis/deliver reports on new products
5. Process development
Job Requirements
1. Master or PH.D, majored in science or engineering
2. Strong hands on skills is a MUST
3. Strong innovative and logical thinking, problem solving skills
4. Self-motivated with sense of accountability
6. Good communication skills, written and verbal, in both Chinese and English
公司介绍
中
中微半导体设备(上海)股份有限公司
中微半导体设备(上海)股份有限公司,成立于2004-05-31,位于上海,法定代表人:尹志尧,登记状态:存续,注册资本62236.3735万人民币,公司类型:其他
公司信息:公司名称:中微半导体设备(上海)股份有限公司公司类型:公司性质:--公司地点:公司规模:涉及领域:--公司网址: